Discussing New Projects and Technologies at the Building Envelope Forum

news_BuildingEnvelopeForumScottArmstrong_900x380

Scott Armstrong, Manager – Building Science & Sustainability, will present at the 2014 Building Envelope Forum in Toronto on May 8.  Themed Strategies for Building Resiliency, the one-day conference will examine common challenges and practical solutions for new and aging building envelopes.

In his session, New Products and Technologies: Rethinking the Conventional Building Envelope, Scott will discuss new materials in the construction marketplace, how conventional wall assemblies are changing to deliver improved thermal performance and air tightness, and how changes in design and construction processes will affect projects.

Scott has more than 15 years’ experience, with expertise in high-performance enclosures, enclosure commissioning and durability, investigation and remediation, heritage restoration, and LEED consulting for new and existing buildings across Canada and in the U.S., the Caribbean, and the Middle East.